Lead, Microelectronics Packaging Design Engineer

Company: L3Harris Technologies
Location: Palm Bay
Posted on: October 30, 2024

Job Description:

Job Title: Lead, Microelectronics Packaging Design EngineerJob Code: 16841Job Location: -Palm Bay, FLJob Schedule: 9/80 (Every other Friday off!)Relocation: Relocation assistance may be provided to qualified applicants -Job Description: -Responsible for leading the electrical design architecture for microelectronic designs using advanced packaging technology including 3D-ICs, 2.5D, chiplets, silicon interposers, and other applications utilizing high density interconnect. At L3Harris, you will engage with both internal and external customers to define architectures and requirements and then flow down to a design team. You will also engage with leads in the packaging integration team to help define electrical test structures for advanced packaging process technology development. - This key role will provide technical insight for our existing technologies and develop new technologies to capture and lead new programs with our military, government, and commercial customers.--- - - -Essential Functions: -

• Define electrical architecture and requirements working with external and internal customers. -
• Design and layout multilayer structures, lead team to create all necessary design files and documentation for advanced packaging designs.
• Perform finite element modeling (FEM) of RF structures using 3D electromagnetic simulation software (HFSS preferred), incorporate analysis results in design structures to optimize performance.
• Communicate with process integration team in development runs, provide inputs for electrical test structures to develop architecture
• Domestic and International Travel Required up to 25% of timeQualifications: -
• Bachelor's Degree and a minimum of 9 years of prior relevant experience or Graduate Degree and a minimum of 7 years of prior related experience. -In lieu of a degree, minimum of 13 years of prior related experience.
• Ability to obtain a U.S. government Top Secret/SCI Security Clearance
• 5+ years experience with advanced microelectronics packaging including through silicon vias, redistribution layers (RDL), chip stacking, and fan out
• Experience with silicon layout design flow
• Experience using 3D EM simulation, HFSS (preferred)Preferred Additional Skills:
• Experience with Silicon Photonics
• Cadence Virtuoso experience is highly preferred
• Strong verbal and written communication skills
• Ability to lead a design team, size 2-10 people -

Keywords: L3Harris Technologies, Fort Pierce , Lead, Microelectronics Packaging Design Engineer, Engineering , Palm Bay, Florida